USER2USER EUROPE 2025 - TRACK
3D integrated circuit and heterogenous packaging
Die2die interaction and complex stacking configurations necessitate novel approaches to design, modeling and physical verification. Swissbit, Fraunhofer, Intel and Alphawave will present their solutions to these challenges.
Sessions in this track
Speakers in this track
Join us at User2User Europe
Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes
innovative keynotes from industry leaders and enriching technical sessions.