User2User North America Smart Hub

The User2User Smart Hub provides attendees the opportunity to interact with our EDA ecosystem.

Connect with external foundry and cloud partners.

Accelerate chip-design verification and simulation workloads on AWS most extensive, reliable and secured Cloud Infrastructure

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. 

As stewards of Moore's Law, we persistently innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain, particularly for advanced products. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era.   www.intel.com/foundry

Invent with purpose, realize cost savings, and make your organization more efficient with Microsoft Azure's
open and flexible cloud computing platform.

Samsung started its foundry business in 2005 to provide cutting-edge technologies to a broad market. Samsung Foundry has decades of manufacturing experience with revolutionary semiconductors. As a leading edge foundry, we collaborate with customers across the globe to relentlessly drive towards the development of the cutting-edge technologies.

TSMC (TWSE: 2330, NYSE: TSM) created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023. These facilities include four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, TSMC Washington in the United States and TSMC China Company Limited. In August 2023, TSMC announced its plan to jointly invest in European Semiconductor Manufacturing Company (ESMC), in Dresden, Germany, to build a specialty technology fab. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027. TSMC continues to execute its plan to construct and operate two fabs in Arizona, the United States. Production of the first fab is targeted for the first half of 2025, and construction of the second fab is ongoing. The Company is also building a new fab in Kumamoto, Japan, with production targeted by late 2024.

Connect with internal Siemens EDA divisions.

3DIC / Chiplet Package Design

Explore how XSI and XPD can be used to improve your 3DIC and IC Packaging design flow.  Our experts will show you how XSI can be used for bump/ball floorplanning, driving electrical and thermal analysis, and LVS with Calibre 3DSTACK.  Interested in learning more about high capacity physical design for organic and silicon packaging applications in a single design tool?  Stop by and ask about XPD - the highest capacity and performance in the market for package design.  Come and see how Siemens' package design platform can take your package from an architectural concept to final sign-off.

Aprisa 2.0 digital IC implementation

Wondering what’s the latest at Siemens EDA in the place-and-route space?  Stop by the Aprisa digital IC implementation Smart Hub to learn about Aprisa 2.0.  This new era for Aprisa extends its functionality to cover RTL2GDSII, it introduces user-oriented AI features, and continues its tighter integration with other Siemens EDA tools.  These capabilities, combined with Aprisa’s well established out-of-the-box flows, and excellent correlation all the way to signoff, make Aprisa the right solution for today’s digital IC designs.

Custom IC/Verification

Stop by the Custom IC Verification Smart Hub and talk with one of our experts about the latest advancements in the Intelligent Custom IC Verification Platform.  Explore the comprehensive portfolio of differentiated, AI powered, cloud ready solutions for simulation, environment, characterization, and IP validation.  Find out what's new with our industry leading solutions, including: Solido Design Environment, Solido Characterization Suite, Solido IP Validation Suite, Analog FastSPICE, and Symphony.

Functional Design & Verification

Experts in Questa simulation, Questa OneSpin Formal verification, and the Visualizer debug environment will be on-hand to answer your questions, and share the latest updates and time-saving workflows.

High-Level Synthesis/Verification

Come visit us to learn about how to achieve better power, performance and area using Catapult and PowerPro. Explore the design of a complex filter for PPA using High Level Synthesis/Verification, and discover how to address power requirements early in the design cycle using RTL Power Analysis and Optimization.

Siemens EDA Consulting and Learning Services

Siemens EDA Services boast a track record of success in improving productivity and mitigating risk in our customers' design and verification flows. Delivered by highly experienced global teams, each service and training offering is designed to maximize your business and technical success.

Siemens EDA Global Support

Our support and service experts provide you with comprehensive support directly from the product manufacturer. Whether you have technical questions or need urgent product and system support, you can reach us via support request, or browse through our online support service websites. Just ask your Siemens contact about the packages available for your individualized support contract.

Tessent SiliconInsight – SSN and iJTAG debug at Bench with Salland DTX

Explore how to accelerate bench testing for your device with our newly announced partner Salland Engineering.  We will demonstrate at speed debug of SSN and iJTAG with the DTX instrument and an FPGA Board, including a full design to test workflow with VelocityCAE.

The Veloce CS system -- transforming hardware-assisted verification

Veloce CS is the leading hardware software and system validation platform, including the Veloce Strato CS emulation platform, Veloce Primo CS enterprise prototyping platform, and Veloce proFPGA CS software prototyping platform meeting the demands of complex chips, software, and systems.  Veloce CS System hardware and software is constructed for congruency among these platforms for the highest productivity and flexibility for our customers. Veloce OS software, Veloce Solutions and Veloce Apps enables flexibility for customers to easily move between these platforms per their needs.